Thông tư 32/2025/TT-BKHCN về Danh mục nguyên liệu, vật liệu bán dẫn, thiết bị, máy móc, công cụ cho công nghiệp bán dẫn được khuyến khích đầu tư phát triển do Bộ trưởng Bộ Khoa học và Công nghệ ban hành

CIRCULAR

ON ISSUANCE OF THE LIST OF MATERIALS, SEMICONDUCTORS, EQUIPMENT, MACHINERY AND TOOLS FOR SEMICONDUCTOR INDUSTRY THAT ARE ENCOURAGED FOR INVESTMENT AND DEVELOPMENT

Pursuant to the Law on Digital Technology Industry No. 71/2025/QH15;

Pursuant to Decree No. 55/2025/ND-CP on functions, responsibilities, jurisdiction and organizational structure of the Ministry of Science and Technology;

At the request of the Director General of the Department of Information Technology Industry;

The Minister of Science and Technology promulgates the Circular on issuance of the list of materials, semiconductors, equipment, machinery and tools for semiconductor industry that are encouraged for investment and development.

Article 1. The list of materials, semiconductors, equipment, machinery and tools for semiconductor industry that are encouraged for investment and development is attached to this Circular.

The list is adjusted and updated in accordance with the Strategy for Development of Semiconductor Industry of Vietnam and the requirements for management of this sector in each period.

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1. This Circular comes into force from January 01, 2026.

2. Organizations and enterprises engaging in producing raw materials, materials, equipment, machinery and tools for semiconductor industry listed in the Appendix of this Circular shall be entitled to the policies for sectors with special investment incentives as prescribed in investment laws and other relevant laws.

Organizations and enterprises are responsible for providing and updating information related to raw materials, materials, equipment, machinery and tools for semiconductor industry that are encouraged for investment and development on the National information system for digital technology industry.

3. Chief of Ministry Office; Director General of the Department of Information Technology Industry; heads of relevant authorities, organizations, enterprises and individuals are responsible for implementing this Circular.

4. Shall any difficulties arise during the implementation of this Circular, report them to the Ministry of Science and Technology (Department of Information Technology Industry) for research, review and guidelines./.

MINISTER




Nguyen Manh Hung

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MATERIALS, SEMICONDUCTORS, EQUIPMENT, MACHINERY AND TOOLS FOR SEMICONDUCTOR INDUSTRY THAT ARE ENCOURAGED FOR INVESTMENT AND DEVELOPMENT
(Attached to Circular No. 32/2025/TT-BKHCN dated November 15, 2025 of the Minister of Science and Technology)

A. THE LIST OF MATERIALS AND SEMICONDUCTORS THAT ARE ENCOURAGED FOR INVESTMENT AND DEVELOPMENT

No.

Materials

Description

1

High-purity silicon (Polysilicon)

Multicrystalline silicon with very high purity for manufacture of single crystal ingots which are then sliced into wafers.

2

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Compounds such as SiC, GaAs, GaN, InP, etc., for manufacture of semiconductor chips that are capable of withstanding high voltage, high temperature, high frequency, etc.

3

Wafer

Semiconductor materials that are melted and formed into single crystal ingots; then sliced, cleaned, polished and oxidized to create wafers before circuit etching. Materials for wafers include Silicon (Si), silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), Indium Phosphide (InP), etc.

4

Photomasks and photomask materials

Substrates that are engraved with semiconductor chip design patterns used in photolithography; materials for making photomasks.

5

Photoresist

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6

Chemicals for semiconductor chip manufacture

Chemicals that are directly used in steps for semiconductor chip manufacture such as oxidation, photolithography, etching, deposition, ion implantation, cleaning and packaging.

7

Specialty gases for semiconductor manufacture

Specialty gases that are used in steps for semiconductor chip manufacture including oxidation, photolithography, etching, deposition, ion implantation, cleaning and packaging.

8

Sputtering targets

Blocks of metal materials such as aluminum, titanium, copper, or alloys that are used as "targets" in Physical Vapor Deposition (PVD) systems via sputtering. When bombarded by ion beams/radiation, materials from the targets are ejected and deposited onto wafer or substrate surfaces in order to form thin metal/alloy films for electrical connection and conduction.

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Leadframes

Structures that are used for supporting and fixing semiconductor chips; providing electrical connections between the chip and circuit board; supporting heat dissipation and mechanical protection of the chip.

10

Substrates

Insulating substrates (made from polymer or composite materials) that are used for attaching semiconductor chips, creating electrical connections between chips and printed circuit boards (PCBs), supporting heat dissipation and mechanical protection during packaging and operation.

11

Materials for packaging semiconductor chips

Insulating and thermally conductive materials (ceramics, polymers, etc.) that are used for manufacture of packaging shells for semiconductor chips, providing protection, stable electrical connection, and efficient heat dissipation.

12

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Ultra-fine metal wires that are used for electrical connection between semiconductor chips and output leads.

13

Materials for attaching wafers, dies and chips

Specialized adhesives (glues, tapes, thin films, etc.) that are used for attaching wafers, dies (individual unpackaged semiconductor chips cut from wafers that contain complete integrated circuits) and chips to substrates or leadframes.

14

Technical ceramics

Specialized ceramics with high hardness, good insulation and wear resistance that are used for manufacture of components such as robot grippers, insulating parts and components requiring high mechanical strength in semiconductor equipment.

B. THE LIST OF EQUIPMENT, MACHINERY AND TOOLS FOR SEMICONDUCTOR INDUSTRY THAT ARE ENCOURAGED FOR INVESTMENT AND DEVELOPMENT

No.

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Description

I

Design

1

IP Cores

Pre-developed, reusable, modular design blocks that allow other organizations to use them for semiconductor chip design.

2

Tools for semiconductor chip design (Electronic Design Automation - EDA tools)

Specialized software tools that are used for designing, simulating, verifying and optimizing semiconductor chip designs.

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Process design kits (PDKs)

Sets of rules, data and models that are provided by semiconductor foundries to chip design companies to ensure compatibility and manufacturability of chip designs in accordance with the foundry’s technology.

4

Equipment and systems for evaluating chip designs and IP Cores

Devices and systems that are used for simulating, verifying and evaluating semiconductor chip designs and IP Cores.

II

Semiconductor chip manufacturing, packaging and testing

5

Crystal growing furnaces

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6

Crystal machining equipment

Equipment for slicing, grinding, lapping, polishing single crystal ingots to create wafers that satisfy thickness, flatness and surface smoothness standards.

7

Ion implanters

Equipment that is used for implanting dopants into silicon wafers to modify electrical properties in a controlled manner to form semiconductor chip components.

8

Photolithography equipments

Specialized equipment that projects light (UV/DUV/EUV/...) through high-precision lens systems to create patterns on silicon wafers replicating chip designs.

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Deposition equipments

Equipment that is used for depositing thin material layers on wafer surfaces by applying technologies such as MBE (Molecular Beam Epitaxy), ALD (Atomic Layer Deposition), CVD (Chemical Vapor Deposition), PVD (Physical Vapor Deposition), etc., for insulating or conductive layers.

10

Etching equipment

Equipment that removes photoresist layers to reveal designed structures by using gases/plasma (dry etch) or liquid chemicals (wet etch).

11

Wafer cleaning equipment

Equipment that removes dust, contaminants and residual films (photoresist, polymers, unwanted oxides, etc.) from wafer surfaces after processing steps.

12

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Equipment that is used for coating, developing, baking/curing photoresist layers on wafer surfaces before and after photolithography steps to ensure uniform thickness and chemical stability for accurate pattern transfer.

13

Wafer bonders and aligners

Equipment that is used for bonding two or more wafers permanently for creating stacked structures, or bonding carrier wafers for thinning, processing and alignment.

14

Automated material handling systems

Systems including equipment for automated transport of wafers, photomasks, and cassettes/FOUPs between processes for reducing contamination and increasing productivity.

15

Process monitoring equipment

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16

Dicing equipment

Equipment using diamond saw blades or lasers to precisely cut patterned wafers into individual dies.

17

Integrated assembly equipment

Packaging systems integrating multiple processes in a seamless line, e.g., die attach, wire bonding, molding, dicing, preliminary testing, etc.

18

Testing equipment

Systems including wafer sort testing; final testing; handlers, trays and probes that are used for measuring functionality, performance, reliability and screen defects before shipment.

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