Quyết định 1314/QĐ-BGDĐT năm 2025 về Chuẩn chương trình đào tạo về vi mạch bán dẫn trình độ đại học, thạc sĩ do Bộ trưởng Bộ Giáo dục và Đào tạo ban hành

DECISION

PROMULGATION OF TRAINING PROGRAM STANDARDS ON SEMICONDUCTOR INTEGRATED CIRCUITS AT UNDERGRADUATE AND MASTER’S LEVELS

MINISTER OF EDUCATION AND TRAINING OF VIETNAM

Pursuant to the Law on Higher Education dated June 18, 2012 and the Law on amendments to the Law on Higher Education dated November 19, 2018;

Pursuant to Decree No. 37/2025/ND-CP dated February 26, 2025 of the Government of Vietnam on functions, tasks, entitlements, and organizational structure of the Ministry of Education and Training of Vietnam;

Pursuant to Circular No. 17/2021/TT-BGDDT dated June 22, 2021 of the Minister of Education and Training of Vietnam on standards and formulation, appraisal, and promulgation of training programs of higher education;

Pursuant to Circular No. 09/2022/TT-BGDDT dated June 6, 2022 of the Minister of Education and Training of Vietnam on the list of academic majors in higher education;

At the request of the Director of the Department of Higher Education.

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Article 1. The Training Program Standards on semiconductor integrated circuits (ICs) at undergraduate and master’s levels is promulgated together with this Decision.

Article 2. This Decision comes into force as of its date of signing.

Article 3. The Training Program Standards on semiconductor ICs shall apply to higher education institutions participating in the implementation of the Program on the development of personnel for the semiconductor industry by 2030, with an orientation toward 2050 under decision No. 1017/QD-TTg dated September 21, 2024 of the Prime Minister of Vietnam; higher education institutions shall develop, review, and update training programs, ensure compliance with the criteria of the Training Program Standards on semiconductor ICs, and submit reports to the Ministry of Education and Training of Vietnam before student admissions.

Article 4. Chief of Office, Director of the Department of Higher Education, Directors of relevant units of the Ministry of Education and Training of Vietnam; Principals, Directors of higher education institutions, heads of organizations, and relevant individuals shall implement this Decision./.

PP. MINISTER
DEPUTY MINISTER




Hoang Minh Son

TRAINING PROGRAM STANDARDS

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1. OVERVIEW

1.1. Introduction

The Training Program Standards on semiconductor ICs at undergraduate and master’s levels (hereinafter referred to as “Training Program Standards”) refers to the mandatory general requirements applicable to all training programs in relevant majors at undergraduate and master’s levels according to current regulations on participation in personnel training for the semiconductor industry. The Training Program Standards include requirements for objectives, graduation requirements, admission requirements, credit load, structure and content, teaching and result assessment methods, faculty and support personnel, facilities, technology, and learning materials.

The Training Program Standards are developed based on Circular No. 17/2021/TT-BGDDT dated June 22, 2021 of the Minister of Education and Training of Vietnam. They also align with the Vietnam National Qualification Framework according to Decision No. 1982/QD-TTg dated October 18, 2016 of the Prime Minister of Vietnam. The development process of the Training Program Standards involves experts and scientists in the semiconductor field. It is also consulted widely with training institutions, employers, and graduates of training programs concerning semiconductor ICs and the requirements for the respective training programs of countries and territories with developed economies, such as the United States, Germany, France, the Netherlands, Japan, South Korea, and Taiwan.

The Training Program Standards serve as the ground for training institutions to develop and implement training programs on semiconductor ICs. Such standards are also the foundation for designing and implementing major-minor, dual-degree, or interdisciplinary programs on semiconductor ICs.

Training institutions may, based on the training orientation and practical conditions, develop teaching programs that are partially or fully in English to enhance learners’ foreign language proficiency and gradually meet international standards. Additionally, the programs must equip learners with interdisciplinary skills, such as programming, simulation, and data analysis, to help them develop technological thinking and the ability to work in global environments, thus meeting domestic and personnel demands in the semiconductor industry.

1.2. List of training majors for semiconductor industry personnel

The list of training majors relevant to semiconductor ICs that may contribute to the personnel training for the semiconductor industry under current regulations includes:

No.

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Training major

Note

I. Undergraduate level

1

7440102

Physics

2

7440110

...

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3

7440112

Chemistry

4

7440122

Materials Science

...

...

...

7460107

Computational Science

6

7460108

Data Science

7

7480101

...

...

...

8

7480102

Computer Networks and Data Communications

9

7480103

Software Engineering

...

...

...

7480104

Information Systems

11

7480106

Computer Engineering

12

7480107

...

...

...

13

7480108

Computer Technology Engineering

14

7480201

Information Technology

...

...

...

7480202

Information Security

16

7480208

Cybersecurity

Pilot Program

17

7510201

...

...

...

18

7510203

Mechatronic Engineering Technology

19

7510206

Thermal Engineering Technology

...

...

...

7510301

Electrical and Electronics Engineering Technology

21

7510302

Electronics and Telecommunications Engineering Technology

22

7510303

...

...

...

23

7510401

Chemical Engineering Technology

24

7510402

Materials Technology

...

...

...

7520101

Engineering Mechanics

26

7520103

Mechanical Engineering

27

7520114

...

...

...

28

7520115

Thermal Engineering

29

7520107

Robotics Engineering

Pilot Program

...

...

...

7520117

Industrial Engineering

31

7520201

Electrical Engineering

32

7520207

...

...

...

33

7520215

Electrical and Electronics Engineering

Pilot Program

34

7520216

Automation and Control Engineering

...

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...

7520301

Chemical Engineering

36

7520309

Materials Engineering

37

7520310

...

...

...

38

7520401

Engineering Physics

II. Master’s level

1

8440104

Solid-state Physics

...

...

...

2

8440105

Radio and Electronics Physics

3

8440107

Solid Mechanics

4

...

...

...

Mechanics

5

8440110

Optics

6

8440112

Chemistry

...

...

...

7

8440113

Inorganic Chemistry

8

8440114

Organic Chemistry

9

...

...

...

Analytical Chemistry

10

8440119

Theoretical and Physical Chemistry

11

8440122

Materials science

...

...

...

12

8460107

Computational Science

13

8460108

Data Science

14

...

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...

Mathematical Foundations of Informatics

15

8480101

Computer Science

16

8480102

Computer Networks and Data Communications

...

...

...

17

8480103

Software Engineering

18

8480104

Information Systems

19

...

...

...

Computer Engineering

20

8480107

Artificial Intelligence

21

8480201

Information Technology

...

...

...

22

8480202

Information Security

23

8480204

IT Management

24

...

...

...

Information System Management

25

8520101

Engineering Mechanics

26

8520103

Mechanical Engineering

...

...

...

27

8520114

Mechatronic Engineering

28

8520117

Industrial Engineering

29

...

...

...

Energy Engineering

30

8520201

Electrical Engineering

31

8520203

Electronic Engineering

...

...

...

32

8520208

Telecommunications Engineering

33

8520209

Cryptographic Engineering

34

...

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...

Automation and Control Engineering

35

8520301

Chemical Engineering

36

8520309

Materials Engineering

...

...

...

37

8520401

Engineering Physics

In addition to the training majors listed above, any other training major approved by the Minister of Education and Training of Vietnam for pilot implementation or inclusion in the list of training programs at undergraduate and master’s levels concerning semiconductor ICs shall comply with these Training Program Standards.

1.3. Graduation degrees

Graduates of training programs on semiconductors ICs at the undergraduate level shall receive bachelor’s degrees. Graduates of specialized in-depth training programs at level 6 shall receive engineer’s degrees (level 6), and at level 7, engineer’s decrees (level 7). Graduates of training programs on semiconductor ICs at the master’s level shall receive master’s degrees.

2. TRAINING PROGRAM STANDARDS

2.1. Training program objectives

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2.2. Graduation requirements of training programs

Graduation requirements of training programs on semiconductor ICs must align with the graduation requirements of the Vietnam National Qualification Framework and the Training Program Standards of the respective industry/field/training major. Training institutions shall develop graduation requirements with appropriate competency levels, ensuring mandatory compliance with Bloom’s Taxonomy corresponding to each training level (Bachelor, Engineer, and Master). Graduates of training programs on semiconductor ICs must meet the minimum competency levels according to the table below:

Graduation requirements

Minimum competency level

Bachelor

Engineer (level 6)

Engineer (level 7)

Master

(1) Knowledge: Ability to determine, define, and solve complex engineering problems concerning semiconductor ICs by applying principles of mathematics, science, and engineering

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Level 4

Level 4

Level 4

(2) Knowledge: Ability to apply engineering designs to develop solutions that meet specific needs concerning semiconductor IC engineering while considering public health, safety, welfare, and global, cultural, social, environmental, and economic factors in conformity with professional ethics

Level 3

Level 4

Level 4

Level 4

(3) Skill: Ability to communicate effectively with multiple subjects and concerned parties, including technical experts, leaders, and non-specialists, ensuring clarity and accuracy in information delivery

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Level 3

Level 4

Level 4

(4) Skill: Ability to work effectively in a professional team setting where members jointly demonstrate leadership, foster collaborative and inclusive environments, set objectives, formulate task plans, and achieve common objectives

Level 3

Level 3

Level 4

Level 4

(5) Skill: Ability to develop and conduct appropriate experiments concerning semiconductor ICs, analyze and interpret data scientifically, and apply engineering judgment to draw relevant conclusions

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Level 3

Level 4

Level 4

(6) Autonomy and responsibility: Ability to recognize ethical and professional responsibilities in technical situations and make informed judgments considering the impact of technical solutions in global, economic, environmental, and social contexts, ensuring sustainability

Level 3

Level 3

Level 4

Level 4

(7) Autonomy and responsibility: Ability to acquire and apply new knowledge to keep pace with the rapid technical developments of semiconductor IC technologies through appropriate learning strategies, ensuring lifelong learning

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Level 3

Level 4

Level 4

(8) Foreign language proficiency: corresponding to each training level as specified in Vietnam’s 6-level Foreign Language Proficiency Framework

3/6

3/6

4/6

4/6

The following graduation requirements are specifically designed for in-depth directions concerning semiconductor ICs, such as IDM, Fabless Design, Foundry, and Tool Manufacturer. Training institutions may integrate the content of the in-depth graduation requirements into the above 8 graduation requirements of training programs on semiconductor ICs, ensuring conformity with the objectives and orientations of the training programs.

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Training programs concerning IDM that are combined with knowledge of Electronics (Electrical Engineering, Electronics, and Telecommunications), Computer Engineering, Physics, Materials Science, Engineering Physics, Chemistry, Chemical Engineering, Mechanical Engineering, Engineering Mechanics, Mechatronics, Robotics Engineering, etc., to train learners to master several stages in the IC manufacturing process, from design and manufacturing to testing.

The graduation requirements of training programs in this direction emphasize the ability to manage and operate the IC manufacturing process, ensuring high-quality design, manufacturing, and inspection of the products in conformity with the needs of IDM companies. Graduates of training programs in the IDM direction must meet the minimum competency levels specified in the table below:

Graduation requirements

Minimum competency level

Bachelor

Engineer (level 6)

Engineer (level 7)

Master

(1) Knowledge: Ability to apply knowledge from physics, chemistry, electronics, mechanics, informatics, or relevant fields in designing, manufacturing, and testing semiconductor ICs, ensuring high productivity and reliability in industrial environments

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Level 4

Level 4

Level 4

(2) Knowledge: Ability to effectively apply various software-based design and simulation methods used during the design and manufacturing of semiconductor ICs

Level 3

Level 4

Level 4

Level 4

(3) Skill: Ability to use specialized tools and methods for specific stages of IC design, manufacturing, and testing, including productivity analysis in laboratory settings and quality assessment of finished products

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Level 3

Level 4

Level 4

(4) Skill: Ability to solve technical issues arising during IC design, manufacturing, and testing or to implement optimization algorithms and programs to improve productivity and extend the product lifespan

Level 3

Level 3

Level 4

Level 4

2.2.2. Fabless design

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The graduation requirements of training programs in the fabless design direction emphasize the ability to design analog, digital, and mixed-signal ICs, proficiency in using specialized design tools, and the ability to optimize the process from concept to final design. Graduates of training programs in the fabless design direction must meet the minimum competency levels specified in the table below:

Graduation requirements

Minimum competency level

Bachelor

Engineer (level 6)

Engineer (level 7)

Master

(1) Knowledge: Ability to apply knowledge of mathematics, physics, electrical circuits, signals and systems, and computer architecture to analyze and understand the technical criteria of semiconductor ICs

Level 3

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...

Level 4

Level 4

(2) Knowledge: Ability to apply knowledge of electrical circuits, analog electronics, digital electronics, programming techniques, and artificial intelligence (AI) to analyze, calculate, design, and simulate semiconductor ICs

Level 3

Level 4

Level 4

Level 4

(3) Skill: Ability to perform verification, logic synthesis, physical design, and assessment of technical targets of semiconductor ICs based on skills in circuits, analog electronics, digital electronics, measurement techniques, and semiconductor components

Level 3

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Level 4

Level 4

(4) Skill: Ability to inspect, measure, and assess technical targets of a semiconductor IC based on skills in circuits, analog electronics, digital electronics, measurement techniques, and semiconductor components

Level 3

Level 3

Level 4

Level 4

(5) Skill: Ability to use scripting languages and AI tools to automate the processes of semiconductor IC design, synthesis, and verification

Level 3

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Level 4

Level 4

2.2.3. Foundry

Training programs concerning foundry combined with knowledge of Physics, Materials Science, Engineering Physics, Chemistry, Chemical Engineering, Electronics (Electrical Engineering, Electronics, and Telecommunications), Mechanical Engineering, Mechatronics, Engineering Mechanics, etc., that provide strong foundations in material structure and properties and operational principles of semiconductor components and methods for handling and manufacturing ICs.

The graduation requirements of training programs in the foundry direction emphasize the ability to operate specific stages in wafer processing, including thin-film deposition, photolithography, etching, dicing, bonding, and packaging, ensuring high quality and productivity in semiconductor IC manufacturing. Graduates of training programs in the foundry direction must meet the minimum competency levels specified in the table below:

Graduation requirements

Minimum competency level

Bachelor

Engineer (level 6)

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Master

(1) Knowledge: Ability to apply knowledge of semiconductor materials, manufacturing technologies, and electronics engineering to analyze or perform certain stages in IC manufacturing, such as wafer surface processing, dopant diffusion, thin-film deposition, etching, testing, and packaging

Level 3

Level 4

Level 4

Level 4

(2) Knowledge: Ability to apply knowledge of specific stages in IC manufacturing to identify factors affecting productivity and product quality, ensuring that the manufacturing meets reliability and efficiency requirements

Level 3

Level 4

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Level 4

(3) Skill: Ability to proficiently perform certain stages in semiconductor IC manufacturing, including wafer processing, diffusion, thin-film deposition, etching, or quality inspection using specialized equipment, ensuring productivity and product quality

Level 3

Level 3

Level 4

Level 4

(4) Skill: Ability to implement solutions to error correction and manufacturing process improvement and execute certain steps in the semiconductor IC manufacturing chain to enhance product stability and efficiency

Level 3

Level 3

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Level 4

2.2.4. Tool Manufacturer

Training programs concerning the tool manufacturer direction combined with knowledge of Computer Science, Computer Engineering, Information Technology, Artificial Intelligence, Electronics (Electrical Engineering, Electronics, and Telecommunications), Mechanics, Engineering Mechanics, Robotics Engineering, Mechatronics, etc., that emphasize the provision of interdisciplinary knowledge, combining high technologies and automation to train learners to be able to design, manufacture, and operate specialized equipment for IC manufacturing.

The graduation requirements of training programs in the tool manufacturer direction emphasize the ability to design, manufacture, and operate equipment and tools that support the IC manufacturing process, including tools used in the semiconductor IC manufacturing process, design software, measurement systems, and product quality inspection systems. Graduates of training programs in the tool manufacturer direction must meet the minimum competency levels specified in the table below:

Graduation requirements

Minimum competency level

Bachelor

Engineer (level 6)

Engineer (level 7)

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(1) Knowledge: Ability to apply principles of physics, informatics, and related knowledge in tools and equipment for semiconductor IC design and manufacturing

Level 3

Level 4

Level 4

Level 4

(2) Knowledge: Ability to apply knowledge of factors affecting the productivity of hardware or software tools and equipment used in semiconductor IC design and manufacturing to propose design improvements and improve product quality and operational efficiency

Level 3

Level 4

Level 4

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(3) Skill: Ability to design software or hardware tools and equipment in semiconductor IC design and manufacturing using appropriate specialized software and AI techniques, ensuring compliance with technical requirements for productivity and reliability during the manufacturing process

Level 3

Level 3

Level 4

Level 4

(4) Skill: Ability to implement remedial solutions to errors arising during the operation and maintenance of software or hardware tools and equipment combined with the application of AI to improve productivity and stability of the tools and equipment

Level 3

Level 3

Level 4

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2.3. Admission requirements of training programs

The admission requirements specify the minimum qualifications, competency, and experience in conformity with the undergraduate and master’s levels concerning semiconductor ICs. Such requirements ensure that learners can successfully study and complete training programs.

2.3.1. Bachelor’s/engineer programs

Candidates shall be admitted under the Regulation on Higher Education Admission of the Ministry of Education and Training of Vietnam and the following requirements:

a) For admission based on the results of the national high school graduation exam:

- The combination of subjects for admission under the Regulation on Higher Education Admission of the Ministry of Education and Training of Vietnam and subjects for admission must have the following subjects:

+ Mathematics;

+ At least one Natural Science subject relevant to training programs on semiconductor ICs.

- The total score of the subject combination must be at least 80% of the maximum score (e.g., a minimum of 24/30 for a 3-subject combination);

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b) For other admission methods: the converted admission score must be equivalent to the conditions specified in Section 2.3.1.

c) For candidates who already have bachelor’s degrees:

- The degrees must be relevant to the intended training major (as specified by training institutions);

- The cumulative GPA of completed training programs must be at least 2,8/4 (or equivalent).

d) For students transferring from other training programs to training programs on semiconductor ICs:

- The current training programs must be relevant to the semiconductor IC training programs (as specified by training institutions);

- Students must meet the conditions specified in Point a of Section 2.3.1;

- The cumulative GPA must be at least 2,5/4 (or equivalent).

2.3.2. Master’s programs

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2.4. Credit load

The minimum credit load of a training institution must comply with the requirements of the Vietnam National Qualification Framework, specifically:

a) Bachelor’s program: 120 credits/Engineer (level 6) program: 150 credits, in addition to Physical Education and National Defense and Security Education under current regulations.

b) Engineer (level 6) program: 150 credits in addition to Physical Education and National Defense and Security Education under current regulations.

c) Master’s program: 60 credits for those holding bachelor’s degrees in the same discipline.

2.5. Structure and content of training programs

The structure includes General Education, Professional Education, Supporting Knowledge, and Graduation Modules.

a) General Education includes courses in political theory, law, physical education, national defense and security education as specified in current regulations. Mathematics, Basic Science, and Informatics/IT must account for at least 30 credits, specifically designed for each training major concerning semiconductor ICs.

b) The time spent on experiments and practical training must account for at least 25% of the total credits in professional education and graduation modules for Bachelor’s and Engineer (level 6) programs; 30% of the total credits in professional education and graduation modules for Engineer (level 7) programs.

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d) Internships and real-world experiences of training programs are encouraged to be conducted at industrial facilities or in-depth research laboratories concerning semiconductor ICs. Graduation theses/projects/dissertations or modules must research and resolve problems related to one of the key stages in the semiconductor industry value chain.

2.6. Teaching and assessment methods

2.6.1. Teaching methods

The teaching methods are designed based on a learner-centered approach where the learner is the central figure in the training process. This approach encourages active participation, creativity, and initiative in learning activities while providing clear orientations to ensure the achievement of graduation requirements for each module, each component, and the overall training program.

a) Undergraduate level: A combination of multiple methods is applied to optimize teaching effectiveness and leverage of technology in high education, specifically:

- Lecture;

- Tutorial;

- Practical Class;

- Laboratory Work;

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- Role Play/Simulation;

- Case Study;

- Blended Learning;

- Open & Distance Learning.

b) Master’s level: A combination of teaching methods is applied to improve learning outcomes, specifically:

- Lecture;

- Industrial Visits;

- Case Study;

- Problem-based Learning PBL;

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- Interactive Learning;

- Research Seminars/Workshops;

- Field Research;

- Supervision of Dissertation.

2.6.2. Learning outcome assessment

a) The assessment of learning outcomes is designed to align with the level of achievement of the graduation requirements for each module and training program. The assessment process focuses on theoretical knowledge and evaluates practical competencies, problem-solving abilities, skills, and learning attitudes to reflect learners’ overall competency.

b) A combination of formative and summative assessment methods is applied, including practical exercises, midterm tests, group/individual projects, and final exams.

c) Assessment methods are diverse and specifically designed for the characteristics of each module and its teaching methods, ensuring objectivity, reliability, and fairness.

d) Learners are encouraged to accumulate knowledge through independent research and scientific projects concerning semiconductor ICs. Such works may be converted into bonus points for relevant courses.

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- Formative assessment: Learning attitude, class attendance, individual/group assignments, midterm tests, and participation in laboratory practice.

- Summative assessment: Final exams or alternative forms of assessment, such as project reports, presentations, or real-world simulations.

e) Training institutions shall stipulate appropriate weightings among assessment components to accurately reflect learners’ competencies and level of graduation requirements achieved. The assessment criteria and weightings must be clearly announced at the beginning of each module. Additionally, regular updates and improvements to assessment methods are carried out to meet practical requirements concerning semiconductor ICs and modern technologies.

2.7. Faculty and support personnel

Faculty and support personnel of training programs on semiconductor ICs must meet the current regulations and the following requirements:

2.7.1. Bachelor’s/Engineer (level6) programs

a) There must be at least 1 PhD holder in a relevant field with expertise in semiconductor ICs working as a tenured lecturer with a minimum of 3 years of experience in higher education teaching or training management, capable of taking charge of the development, design, and implementation of training programs.

b) There must be at least 5 PhD holders with relevant expertise working as tenured lecturers to take charge of the teaching of programs. Each program component must be led by a lecturer whose expertise aligns with the teaching content. A lecturer is considered to have relevant expertise if he/she meets the Training Program Standards of the Ministry of Education and Training of Vietnam and the following requirements:

- The lecturer holds a PhD or master’s degree in a field determined by the training institution’s Training and Science Council as relevant to take charge of the teaching of at least 2 core modules in a component of the training program while having at least 2 years of direct experience in teaching such modules in full.

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c) Lecturers teaching the modules in the training program must have relevant expertise and be capable of selecting, designing, and applying appropriate teaching and assessment methods to meet the graduation requirements. Lecturers teaching theoretical modules must have a master’s degree or higher, and teaching assistants must have at least a bachelor’s degree. Lecturers/instructors for practical content must have at least a bachelor’s degree and be capable of guiding students and operating related equipment/software for practical training.

d) Each training program must maintain at least 3 guest lecturers participating in the teaching whose current work concerns semiconductor ICs with at least 5 years of in-depth practical experience. Guest lecturers must not be responsible for teaching an entire module in the training program.

dd) There must be sufficient support staff to assist training activities at lecture halls (operating teaching equipment) and support learners in libraries, learning material centers, computer labs, and self-study/research spaces.

2.7.2. Engineer (level 7) programs

The faculty and support personnel of Engineer (level 7) programs must meet the requirements applicable to Bachelor’s/Engineer (level 6) programs. Additionally, lecturers of in-depth modules (level 7) must meet the requirements applicable to lecturers with master’s degrees and have in-depth practical experience in the semiconductor industry.

2.7.3. Master’s programs

a) There must be at least 1 PhD holder in a relevant field with expertise in semiconductor ICs working as a tenured lecturer with a minimum of 5 years of experience in higher education teaching or training management, capable of taking charge of the development, design, and implementation of training programs.

b) Lecturers teaching in-depth modules and supervising theses must have published scientific research or in-depth practical experience in the semiconductor industry.

2.8. Facilities, technologies, and learning materials

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b) General laboratories, electronic practice rooms, computer labs, learning and training management systems, and specialized tools for teaching, learning, and research concerning semiconductor ICs in accordance with the requirements of the training programs must be adequately provided, easily accessible, and regularly maintained and upgraded.

c) Library services, computer infrastructures, information, and specialized resources concerning semiconductor ICs must be sufficiently available to effectively support learners and lecturers in learning, research, and professional development. Libraries must offer a wide range of specialized materials, especially reference materials in English, to help learners and faculty access the latest global knowledge and technologies.

d) Computer infrastructures must have specifications capable of handling complex applications and simulations, ensuring connection with international databases for research purposes.

dd) There must be at least 3 strategic partner enterprises operating in the semiconductor industry that participate in developing programs, training, and offering internship opportunities for learners.